A Scalable Patterning Method for High-Performance Electronic Devices
Ryugo Shimamura - Parallel A
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09/20/2024
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Student’s name: Ryugo Shimamura
Home institution: The University of Tokyo
NNCI site: SENIC @ Georgia Institute of Technology
REU Principal Investigator: Dr. Michael Filler and Dr. Eric Vogel - Georgia Institute of Technology
REU Mentor: Daniel Aziz - Georgia Institute of Technology
Abstract: Rapid progress in semiconductor technology relied on miniaturization of transistors, but as channel dimensions approach the atomic scale, efforts for miniaturization are becoming less economic. Using doped silicon nanowires (SiNW) as electronic components is a viable option, since they can be produced in a massively parallel manner. To realize this concept, patterning methods that allow for surface functionalization of SiNW sidewalls are essential, but since conventional photolithography methods are not compatible with scalable parallel manufacturing, novel methods are needed. Promising results has been shown using PMMA polymer, combined with a doping-dependent etching of Silicon that allows PMMA to be removed from less doped regions selectively. This work covers three contributions. First, relationship between SiNW growth conditions and selectivity of etching is presented. Substrates for growth, gas flow rate and growth temperature are the key factors to a successful patterning. Secondly, a design for testing SAM(Self-Assembled Monolayer)-initiated polymerization effectively, which incorporates multiple characterization schemes such as scanning electron microscopy (SEM), atomic force microscopy (AFM), reflectometry and ellipsometry has been created. Lastly, analysis of polymer removal from differently doped silicon will be presented to show masking of desired regions. Above contributions will enhance understanding of key processes, promising to build a foundation for scalable patterning of electronic nanostructures.
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- [00:00:00.000]Hello, my name is Ryo Yoshimura. I come from the University of Tokyo. I usually research
- [00:00:06.080]field emitters and data analytics applications, but for the summer I've been sitting with the
- [00:00:12.240]fellow group at the Georgia Institute of Technology, researching about a scalable
- [00:00:16.400]pattern for high performance electric devices. So at the fellow group, all our research
- [00:00:23.680]motivation comes from one problem: that transistor prices are too high. So what's limiting transistor
- [00:00:30.960]prices is that the planar process is integrated to the manufacturing process. So for example,
- [00:00:37.680]photolithography, which is a fundamental part of semiconductor fabrication, is only scalable by
- [00:00:43.600]area and not by volume. So for those who aren't familiar with the photolithography method,
- [00:00:50.640]I'll go through the basics with you. So we start off with
- [00:00:53.600]a circular substrate covered with what's called resists. And resists are photosensitive polymers
- [00:01:01.920]that can be patterned with light. So if you cast light upon a selected area of the resist,
- [00:01:09.200]that changes the solubility and then that gives you a desired pattern. And because of the optical
- [00:01:16.640]limits of photolithography, you have to kind of miniaturize the design that you're working with,
- [00:01:22.640]so you can only expose a certain amount of area per wafer if you're trying to gain a good
- [00:01:30.240]resolution. And that makes this process a cleaner process. And at the Philly Group,
- [00:01:38.480]we're looking into a novel method for patterning which we call Durban Selective PMMA engine,
- [00:01:46.160]and I'll go through the procedures with you. So first we start off with a silicon
- [00:01:51.680]transistor-like structure. So we have like a dopant profile that's varying across the areas,
- [00:01:59.760]and then we move on to the second part where we polymerize
- [00:02:06.800]the whole structure using PMMA. And then when we dip the structure into KOH, the OH- ions
- [00:02:14.800]selectively attack the silicon in the less-doped regions, which gives like a lift-off
- [00:02:20.720]of the polymers on the less-doped regions and not on the more-doped regions. So as a result, we get
- [00:02:29.680]a structure where the less-doped regions aren't covered with polymers but are covered for the
- [00:02:36.400]more-doped regions. And this method is especially useful for MOSFET fabrication because for MOSFET
- [00:02:42.640]gate metal and gate oxide deposition, the desired design that we want to do lithography
- [00:02:49.760]matches the dopant profile of the structure. And also another advantage of this method is that it
- [00:02:59.360]can be massively parallel done, so all the polymerization and the etching can be done
- [00:03:05.360]in a reaction chamber. So even if you have one wafer, two wafers, 10 wafers, 100 wafers, as long as you
- [00:03:12.000]have a big enough reaction chamber you can dip the whole thing in and get the results out unlike
- [00:03:18.320]conventional photolithography.
- [00:03:19.520]And another advantage is that it can be done on non-planar structures. So in the middle,
- [00:03:26.880]in previous research, we were able to show that this method works for silicon nanowires,
- [00:03:33.600]so a n-doped silicon nanowire and a non-doped silicon nanowire. And with force coloring for
- [00:03:41.200]PMMA in yellow, we're able to see that PMMA is only existent in the n-doped regions and not
- [00:03:48.160]in the non-doped regions.
- [00:03:49.360]So the scope of my project for the summer was to see if this was applicable for an NPN or a PNP,
- [00:03:58.320]more transistor-like structures, and I worked with a more later structure. So this is what I
- [00:04:05.120]worked with. And so there's a silicon, we call this a Mesa transistor, that's on a silicon dioxide
- [00:04:13.120]substrate for the installation purposes. And just to recap, after polymerization, it should look
- [00:04:19.200]like this. So old structure covered with PMMA, and after KOH, there should be a reduction in PMMA
- [00:04:26.640]for the less-doped regions. But the problem is, how do we characterize this?
- [00:04:32.480]And we went into, first we went to look at EDS, energy dispersive x-ray spectrometry,
- [00:04:40.320]and it's a great and direct way to characterize elements in a given sample. But
- [00:04:49.040]as you can see in the picture, this is a carbon mapping of the given MESA structure. We're not
- [00:04:56.080]able to clearly see that the channel region is free of carbon, and we do see a lot of carbon
- [00:05:03.680]in source and drain regions, but the sensitivity wasn't enough. So we went on to look at AFM,
- [00:05:13.040]which stands for atomic force microscopy, which is a method to characterize the height
- [00:05:18.880]profile of a given sample. And although it doesn't have direct element analysis capabilities,
- [00:05:25.680]we thought that we would be able to determine if the regions had PMMA or not by measuring
- [00:05:31.520]before and after polymerization, and also before and after etching. And just to recap,
- [00:05:40.160]so using the AFM, we were able to characterize the step height between the polymer stop and
- [00:05:48.720]and also the substrate, and we should be seeing a significant reduction in the step height for the
- [00:05:56.240]N- regions, whereas we shouldn't be seeing that much of difference for the P++ regions. And we
- [00:06:03.120]were able to observe this trend using AFM, so this suggests that selective PMMA etching for the
- [00:06:11.520]channel region was successful. However, there's two difficulties in interpreting this data. So
- [00:06:18.560]firstly, because we're using AFM for characterization, there's six variables that are incorporated in
- [00:06:25.520]this graph. So that is the initial and final thickness of SiO2, silicon, and the PMMA. So that makes it different
- [00:06:35.900]difficult to interpret. So, are these trends coming from the reduction in silicon dioxide
- [00:06:41.060]or reduction in silicon ore? Is it the reduction in PMMA that we want to get? And also, we're
- [00:06:50.020]seeing a trend in the P++ regions, which is very random, and sometimes the delta step
- [00:06:58.040]height is positive, sometimes negative, so we wanted to give a good explanation for that.
- [00:07:02.980]So I looked into other methods to more directly characterize PMMA existence in general regions.
- [00:07:09.620]The first method we went into is AFM-IR on the right. So unlike regular AFM, which just
- [00:07:16.700]gets the height profiles of the sample, AFM-IR uses IR source to heat up the sample using
- [00:07:26.320]infrared light. And because the sample absorbs some of the IR light, it expands due to the
- [00:07:32.960]thermal expansion. And that can be detected using the cantilever that we use for a regular
- [00:07:38.500]AFM. And through the measurement, we should be able to see a spectrum of IR absorption
- [00:07:44.820]just like in a FTIR measurement. And this would give us chemical bonding information
- [00:07:51.040]about the sample. So preliminary results showed that only for the P++ regions, we are able
- [00:07:58.280]to see a characteristic C00 stretch and the COC stretch.
- [00:08:02.940]For PMMA, and that wasn't existent or it was the peak was very small for the N- regions.
- [00:08:13.020]The second method we looked into is optical characterization of thin films, namely L-psomchi
- [00:08:19.500]and reflectomchi. They are both ways to characterize the thickness of a thin film, for example,
- [00:08:27.140]SiO2 or even PMMA. The problem was that our conventional method
- [00:08:32.920]that we were working with didn't support these methods due to them requiring a large
- [00:08:41.880]space for characterization. So we went on to fabricate, to create, a new design.
- [00:08:48.760]So we have a 4-inch wafer filled with 400 chips that supports the optical characterization.
- [00:08:56.600]Each chip has an optical and AFM measurement stations. So our intention was that
- [00:09:02.900]we should be able to compensate for some of the six variables that were incorporated
- [00:09:09.880]in the AFM through the optical measurement. And also, we were working with a very uniform
- [00:09:17.240]dimension of transistors. However, we gave it 64 variations for each chip, just so that
- [00:09:25.540]the electrical characterization would be interesting in the future. And here's the
- [00:09:32.880]result. And we were able to obtain very similar results to what we obtained previously. So
- [00:09:41.420]this is the AFM result, but we compensated for the change in SiO2 thickness using optical
- [00:09:49.560]measurements. So it's six variables reduced to four variables. And also, we are able to
- [00:09:59.060]see that the P++ has a much more--
- [00:10:02.860]consecutive interpretable result compared to what we had before. And also, in addition,
- [00:10:08.920]because all the measurements became negative, we are able to do a new plot of selectivity.
- [00:10:14.740]So this is the etching of N- over the etching of P++. So we are able to quantitatively
- [00:10:23.360]characterize how good our selective etching process is. And here's the conclusion.
- [00:10:32.840]I started off with the motivation that the convention for the orthography method was
- [00:10:37.960]too pricey, and then moved on to talk about the new method using PMMA and selective etching.
- [00:10:45.260]And we obtained results from AFM, AFM-by-bar, and optical characterizations, which supported
- [00:10:52.880]that PMMA was only existent in the source and channel regions.
- [00:10:57.700]And future works would include the deposition of gate materials to these transistor structures
- [00:11:02.820]to gain the electrical characteristics, and also its application to non-planar structures
- [00:11:08.000]such as silicon outliers.
- [00:11:10.080]I thank all the funding and my PEI, my research group, and I'm open to any questions.
- [00:11:16.020]Thank you.
- [00:11:17.020]We do have a moment for questions, yes?
- [00:11:26.540]So what was the purpose of varying the channel sizes in your MESA design?
- [00:11:32.800]Right, so about the dimensions of the transistors.
- [00:11:38.140]So one of the goals was to see if this method was applicable to all kinds of dimensions
- [00:11:45.920]of transistors.
- [00:11:47.240]So the initial design only incorporated, I think, this MESA, but we wanted to see if
- [00:11:55.180]it works for a more smaller structure and also for a larger structure.
- [00:11:59.640]And the other is the electrical characterization.
- [00:12:02.780]Thank you.
- [00:12:03.780]Good presentation.
- [00:12:04.780]Thank you.
- [00:12:05.780]How are you able to get local doping profiles?
- [00:12:09.780]Right.
- [00:12:10.780]So it's, I don't have a slide for, thank you for the question about the doping.
- [00:12:17.020]And so in our fabrication steps, we have, we work, we have a silicon dioxide layer at
- [00:12:25.380]the top first.
- [00:12:26.380]So let's see.
- [00:12:32.760]So in the fabrication process, we have a silicon dioxide layer that covers the whole wafer
- [00:12:39.460]first, and then we pattern that using photolithography actually to get rid of the silicon dioxide
- [00:12:48.260]in actually in the two source and drain regions and dope them then.
- [00:12:55.700]So this, but for our silicon nanowire works.
- [00:13:02.740]We can do a massively parallel fabrication of the P plus plus and my SMP plus plus regions
- [00:13:08.300]without using photolithography.
- [00:13:09.300]Thank you very much.
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